TECHNOLOGIES
• Back drilling for blind vias
• Blind and buried vias
• Stacked microvias
• Counterbore / cylindrical
• Halfbored PTH / castellated
• Laser microvias
• Press-fit holes
• Plugged vias
• BGA active pads
• Asymmetric stack-up
• Hybride stack-up (FR-4 + Rogers)
• Kapton film
• Multicolor mask
• Terminating coating
• Galvanic flash
• Peelable mask
• Connector edge chamfer (ISA 45, PCI 20)
• Silcon roll for RFPCB
• Z- axis routing
| Technologies | / IMC | / Flexible | / Standard | / HDI |
|---|---|---|---|---|
|
3D metallization
|
Y
|
Y
|
||
|
Edge platting/gold platting
|
Y
|
|||
|
Back-Drill Burred VIAs
|
Y
|
|||
|
Blind & buried VIAs
|
Y
|
Y
|
||
|
Cross blind-buried VIAs
|
Y
|
Y
|
Y
|
|
|
Countersink/counterbore hole
|
Y
|
Y
|
Y
|
|
|
Half-cutted/Castellated hole
|
Y
|
Y
|
Y
|
|
|
Laser Micro VIAs
|
Y
|
Y
|
||
|
Press-fit hole
|
Y
|
Y
|
||
|
Plugged VIAs
|
Y
|
Y
|
Y
|
Y
|
|
Via-in-Pad Technology
|
Y
|
|||
|
Asymmetric stack-up
|
Y
|
Y
|
||
|
Hybrid stack-up (FR-4 + Rogers)
|
Y
|
Y
|
||
|
Kapton tape
|
Y
|
Y
|
Y
|
|
|
LTCC
|
Y
|
|||
|
Mirorred Alu
|
Y
|
Y
|
||
|
Multicolor tech
|
Y
|
Y
|
||
|
Peelable solder mask
|
Y
|
Y
|
Y
|
|
|
Silicone roll for Rigid-flex PCB
|
Y
|
Y
|
||
|
Jump-scoring
|
Y
|
Y
|
Y
|
Y
|
|
Z-Routing
|
Y
|
Y
|
Y
|
Y
|
|
Press fit coin technology
|
Y
|
Y
|